Impact of the Drying Process on Surface Particles of Silicon Wafers

In the cleaning process, an important influencing factor is the dryer. The main influencing conditions of the dryer are the spin speed during spin-drying and the drying time. 

To explore the effects of these two factors, actual experiments are needed for verification and explanation. The cleaned silicon wafers are placed in the dryer, and the data is statistically analyzed. After the experimental data is obtained, the following analysis should be conducted: the relationship between spin speed and surface particles.

From the chart above, it can be seen that when the spin speed is below 2000 RPM, the water removal effect is poor, and the particle issues are more severe on the surface, with a high particle count posing a significant threat to the quality of the chips. Therefore, this is not acceptable in production. The impacts of spin speeds between 3000 RPM and 4500 RPM can be neglected. However, at speeds above 5000 RPM, excessive speed can lead to fragment issues, resulting in particle contamination.

Relationship Between Drying Time and Surface Particles

The chart indicates that the impact of drying time on surface particles is relatively small, with the surface area of particles on the silicon wafers remaining below 0.06. It can be concluded that drying time does not have a direct impact on surface particles.