In semiconductor manufacturing, a Monitor Wafer is a type of wafer specifically used for process monitoring, equipment status checking, and yield evaluation. It is representative but does not participate in the circulation of final finished products.
Typically, silicon wafers cut from the lower-quality parts on both sides of a crystal ingot are used instead of actual product wafers. By running through the same process steps, observing their surface morphology, electrical properties, film thickness, etching depth, etc., it can be determined whether the station is operating normally.
What is its application in semiconductor manufacturing production lines?
Process | Typical Monitoring Parameters |
PVD/CVD/ALD | film thickness, film stress, uniformity, and defect density |
Etching | etch depth, sidewall angle, residue, and critical dimension |
Lithography | exposure alignment accuracy, line width, morphology, photoresist thickness, and development residual photoresist |
Cleaning | surface particles, residues, and metal contaminant ions |
Electroplating | thickness, resistivity, deposition uniformity, and hole filling capability |
RTP Furnace | diffusion layer depth, doping concentration, and recrystallized grain |
What are daily monitor and routine monitor?
Daily Monitor: A monitoring task conducted regularly every day, usually fixed at a certain shift or time point. It is mainly used to confirm whether the equipment status is normal and whether the process is drifting.
Routine Monitor: A monitoring task carried out according to a fixed cycle (such as monthly or every 50 wafers). It covers a wider range and more comprehensive content, and is used for trend analysis, long-term stability judgment, and PM plan formulation.
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