Welcome: Supsemi Electronic Technology Co., Ltd
sales@supsemi.com
+86-18059149998
Brand: Supsemi
Description:
Dimensions: 4 inches, 5 inches, 6 inches, 7 inches, 8 inches, 10 inches
Material: POM+GF (Sai Steel+Fiberglass)
Purpose: Used for semiconductor packaging LED chip solidification machine
Product Parameters:
Product Name: Wafer Expansion Ring
Dimensions: 4 inches, 5 inches, 6 inches, 7 inches, 8 inches, 10 inches
Material: POM+GF (Sai Steel+Fiberglass)
Purpose: Used for semiconductor packaging LED chip solidification machine
| Parameters | ||
| Size( inches) | Inner Diameter | Outer Diameter |
| 4 | 103 | 116 |
| 5 | 122 | 135 |
| 6 | 141 | 152 |
| 6 | 139 | 152 |
| 7 | 172 | 186 |
| 8 | 195 | 210 |
| 8 | 197 | 210 |
| 10 | 227 | 249 |
| 10 | 240 | 25 7 |
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Contact: Bruce Liu
WhatsApp: +86-18059149998
Tel: +86-18059149998
Email: sales@supsemi.com
Add: Room 1402, Building 1, No. 89 Xibeilu, Xishancun, Xibei Street, Xinluo District, Longyan City, Fujian Province
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