Customization Button-Controlled UV De-bonding Machine for Wafer Adhesive Removal - Effective UV Film Adhesion Reduction

Customization Button-Controlled UV De-bonding Machine for Wafer Adhesive Removal - Effective UV Film Adhesion Reduction

Brand: SupSemi

Model: SUP-MX200 、SUP-MX300

Description: Button-Controlled UV De-bonding Machine for Wafer Adhesive Removal,Support for customization.

Support for customization

Parameters
Product Model	SUP-MX200 、SUP-MX300	Power	650W(SUP-MX200)/ 950W(SUP-MX300)
Operating Voltage	AC 220V, 50Hz (110V optional)	Control Method	Button control
Lifespan	>20,000 hours	Storage Environment	15°C - 25°C
Operating Environment	-10°C - 50°C	UV Intensity	>400 mW/cm²
Emission Angle	60 degrees	Emission Area	310mm × 310mm
Single Lamp Power	3W	Compatible Wafer Sizes	6-inch/ 8-inch/10-inch/12-inch
Wavelength	365nm